MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERATION: A COMPARATIVE STUDY
Author:
Affiliation:
1. a Department of Logistics Management , Shu-Te University , 59 Hun Shan Rd., Yen Chau, Kaohsiung County, 82445, R.O.C
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/10170660909509162
Reference22 articles.
1. Multi-objective stacking sequence optimization of laminated cylindrical panels using a genetic algorithm and neural networks
2. A fuzzy AHP-based simulation approach to concept evaluation in a NPD environment
3. DYNAMIC MULTI-RESPONSE EXPERIMENTS BY BACKPROPAGATION NETWORKS AND DESIRABILITY FUNCTIONS
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material;Journal of Electronic Materials;2023-11-05
2. A review on numerical approach of reflow soldering process for copper pillar technology;The International Journal of Advanced Manufacturing Technology;2022-07-18
3. The Optimal Solution of Reflow Oven Recipe based on Physics-guided Machine Learning Model;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-03
5. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering;Recent Progress in Lead-Free Solder Technology;2022
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3