Impact of FEOL cross-heating on the thermal performance of advanced BEOL

Author:

Lofrano Melina1,Vermeersch Bjorn1,Oprins Herman1,Park Seongho2,Tokei Zsolt2

Affiliation:

1. Imec,Thermal Modeling and Characterization,Leuven,Belgium

2. Imec,Cohesive Program Management,Leuven,Belgium

Publisher

IEEE

Reference10 articles.

1. Joule heating investigation for advanced interconnect schemes with airgaps

2. Joule Heating study in scaled Cu, Co and Ru interconnects;lofrano;2019 IEEE International Interconnect Technology Conference (IITC),2019

3. Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages;oprins;Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels Microchannels and Minichannels Volume 1 Thermal Management,2015

4. Reliability of a DME Ru Semidamascene scheme with 16nm wide Airgaps;lesniewska;IEEE International Reliability Physics Symposium (IRPS),2021

5. Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Towards accurate temperature prediction in BEOL for reliability assessment (Invited);2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

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