Toward Optimal Defect Detection in Assembled Printed Circuit Boards Under Adverse Conditions

Author:

Noroozi Mohammad1ORCID,Ghadermazi Jalal1ORCID,Shah Ankit1ORCID,Zayas-Castro José L.1ORCID

Affiliation:

1. Department of Industrial and Management Systems Engineering, University of South Florida, Tampa, FL, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Optimizing Automated Optical Inspection: An Adaptive Fusion and Semi-Supervised Self-Learning Approach for Elevated Accuracy and Efficiency in Scenarios with Scarce Labeled Data;Sensors;2024-09-04

2. Detection and Classification of Defects on Printed Circuit Board Assembly through Deep Learning;2024 9th International Conference on Smart and Sustainable Technologies (SpliTech);2024-06-25

3. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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