Author:
Lall Pradeep,Kasturi Madhu,Wu Haotian,Suhling Jeff,Davis Edward
Cited by
5 articles.
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1. Enhanced Thermal Management in Microelectronics Packaging With 2D h‐BN Nanocomposite Underfills;Nano Select;2024-08-08
2. Effect of Thermal Cycling on the Evolution of Interfacial Fracture Toughness of EMC-Substrate Interface;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Evolution of TIM/Copper Interface under Wide Temperature Excursions;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
4. Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05