An Integrated Structure–Material Optimization Strategy for the Packaging of High-Voltage Insulated Gate Bipolar Transistors-Reference-Cited by-同舟云学术

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An Integrated Structure–Material Optimization Strategy for the Packaging of High-Voltage Insulated Gate Bipolar Transistors

Published:2022-12 Issue:6 Volume:29 Page:2163-2170
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Zhong Lipeng¹^ORCID,Liu Wei¹^ORCID,Xi Yingwei¹,Wang Feng¹^ORCID,Chen She¹^ORCID,Sun Qiuqin¹^ORCID,Sun Youqing²,Fei Guanghai³^ORCID

Affiliation:

1. School of Electrical and Information Engineering, Hunan University, Changsha, China

2. Department of Materials Engineering, Katholieke Universiteit Leuven (KU Leuven), Leuven, Belgium

3. Centre for Membrane Separations, Adsorption, Catalysis, and Spectroscopy, Katholieke Universiteit Leuven (KU Leuven), Leuven, Belgium

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/9999164/09906304.pdf?arnumber=9906304

Reference35 articles.

1. Geometrical Techniques for Electric Field Control in (Ultra) Wide Bandgap Power Electronics Modules

2. In situ electric field driven assembly to construct adaptive graded permittivity BaTiO3/epoxy resin composites for improved insulation performance

3. Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors

4. Significantly improved dielectric properties and energy density of polymer nanocomposites via small loaded of BaTiO3 nanotubes

5. Combined geometrical techniques and applying nonlinear field dependent conductivity layers to address the high electric field stress issue in high voltage high-density wide bandgap power modules

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1. Characterization of Space Charge Transport in Power Module Packaging Systems Under Different Operating Conditions;2024 IEEE 7th International Electrical and Energy Conference (CIEEC);2024-05-10

2. A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging;2024 IEEE Texas Power and Energy Conference (TPEC);2024-02-12

3. Characterizing Nonlinear Field Dependent Conductivity Layers to Mitigate Electric Field Within (U)WBG Power Modules Under High Frequency, High Slew Rate Square Voltage Pulses;2024 IEEE Texas Power and Energy Conference (TPEC);2024-02-12

4. A hBN/B-Si-Al-O-glass composite coating growth on SiCp/Al composite using one-step PEO with nanoparticle addition for outstanding electrical insulation performance;Surface and Coatings Technology;2023-12

5. Multi-material and parameter-controllable stereolithography 3D printing of graded permittivity composites for high voltage insulators;Virtual and Physical Prototyping;2023-10-24

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