Characterization of Space Charge Transport in Power Module Packaging Systems Under Different Operating Conditions
Author:
Affiliation:
1. School of Electrical Engineering, Chongqing University,State Key Laboratory of Power Transmission Equipment Technology,Chongqing,People's Republic of China
2. China Electric Power Research Institute,Beijing,People's Republic of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10582916/10582978/10583419.pdf?arnumber=10583419
Reference15 articles.
1. A Review of High Speed GaN Power Modules: State of the Art, Challenges, and Solutions
2. Auxiliary Power Supplies for High-Power Converter Submodules: State-of-the-Art and Future Prospects
3. Cactus-like double-oriented magnetic SiC and BN networks leading to simultaneously enhanced dielectric strength and thermal conductivity of epoxy composites
4. Packaging Design of 15 kV SiC Power Devices With High-Voltage Encapsulation
5. Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite
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