A Fault Detection Method for Partial Chip Failure in Multichip IGBT Modules Based on Turn-Off Delay Time
Author:
Affiliation:
1. State Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China
2. CRRC Yong Ji Electric Company, Ltd., Shanxi Yongji, Shanxi, China
Funder
Shanxi Provincial Department of Science and Technology
National Key Research and Development Program of China
National Science Fund Subsidized Project
National “111” Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/9780469/09766026.pdf?arnumber=9766026
Reference22 articles.
1. Monitoring Bond Wires Fatigue of Multichip IGBT Module Using Time Duration of the Gate Charge
2. Monitoring Bond Wire Defects of IGBT Module Using Module Transconductance
3. A real-time aging monitoring method of parallel-connected IGBT modules
4. Prethreshold Voltage as a Low-Component Count Temperature Sensitive Electrical Parameter Without Self-Heating
5. A novel on-line method for monitoring the junction temperature of SiC MOSFET based on threshold voltage;zhang;Proc CSEE,2020
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1. In Situ Monitoring Chip Failure in Multichip IGBT Modules Using Turn-On Delay Time Extracted From Auxiliary Emitter Voltage;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-06
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4. Degradation state analysis of the IGBT module based on apparent junction temperature;Protection and Control of Modern Power Systems;2023-10-27
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