Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors-Reference-Cited by-同舟云学术

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Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors

Published:2020-12 Issue: Volume: Page:
ISSN:
Container-title:2020 European Conference on Optical Communications (ECOC)
language:
Short-container-title:

Author:

Noriki A.,Tamai I.,Ibusuki Y.,Ukita A.,Suda S.,Takemura K.,Shimura D.,Onawa Y.,Yaegashi H.,Amano T.

Funder

New Energy and Industrial Technology Development Organization

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9332916/9333039/09333180.pdf?arnumber=9333180

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Scalable Fabrication of 3D Optical Re-distribution for Co-Packaged Optics using an Developed Nanoimprint Stepper;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics;Journal of Lightwave Technology;2023-08-01

3. Self-aligned optical connector assembly on polymer waveguide integrated package substrate for co-packaged optics;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Micromirror fabrication for co-packaged optics using 3D nanoimprint technology;Journal of Vacuum Science & Technology B;2022-12

5. Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics;IEEE Photonics Technology Letters;2022-09-01

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