Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics-Reference-Cited by-同舟云学术

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Published:2023-08-01 Issue:15 Volume:41 Page:5078-5083
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Noriki Akihiro¹^ORCID,Ukita Akio²,Takemura Koichi³^ORCID,Suda Satoshi¹,Kurosu Takayuki¹^ORCID,Ibusuki Yasuhiro⁴,Tamai Isao⁵,Shimura Daisuke⁵,Onawa Yosuke⁵^ORCID,Yaegashi Hiroki⁵^ORCID,Amano Takeru¹^ORCID

Affiliation:

1. National Institute of Advanced Industrial Science and Technology, Tsukuba, Japan

2. NEC Corporation, Tokyo, Japan

3. AIO Core Company Ltd., Tokyo, Japan

4. Furukawa Electric Company Ltd., Tokyo, Japan

5. Oki Electric Industry Company Ltd., Tokyo, Japan

Funder

New Energy and Industrial Technology Development Organization

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/50/10190599/10146413.pdf?arnumber=10146413

Reference14 articles.

1. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

2. IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force,0

3. High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

4. Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

5. Low propagation loss of a single mode polymer optical waveguide on a glass epoxy substrate

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