Self-aligned optical connector assembly on polymer waveguide integrated package substrate for co-packaged optics

Author:

Noriki Akihiro1,Amano Takeru1

Affiliation:

1. National Institute of Advanced Industrial Science and Technology (AIST),Platform photonics research center,Tsukuba,Japan

Publisher

IEEE

Reference8 articles.

1. CMOS-Compatible Silicon Etched U-Grooves With Groove-First Fabrication for Nanophotonic Applications

2. V-groove assisted passive assembly of single-mode fibers to ultra-broadband polarization-insensitive edge couplers for silicon photonics;he;45th European Conference on Optical Communication (ECOC 2019),2019

3. MT-ferrule compatible passive optical coupling for single-mode polymer waveguide in co-packaged optics

4. Low-Cost MT-Ferrule-Compatible Optical Connector for Co-packaged Optics Using Single-Mode Polymer Waveguide

5. The future of packaging with silicon photonics;patterson;Chip Scale Rev,2017

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Development of all-photonics-function embedded package substrate using 2.3D RDL interposer for co-packaged optics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Co-packaged Optics;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

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