Lock-in Thermography Failure Detection on Multilayer Ceramic Capacitors After Flex Cracking and Temperature–Humidity–Bias Stress
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
http://xplorestaging.ieee.org/ielx7/6245517/8515215/08444369.pdf?arnumber=8444369
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. DC-link Capacitance Estimation based on Discharge Profile of Inverter for EV Application;2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia);2023-05-22
2. Thermogram Based Indirect Thermographic Temperature Measurement of Reactive Power Compensation Capacitors;Energies;2023-02-23
3. Lock-In Thermal Test Simulation, Influence, and Optimum Cycle Period for Infrared Thermal Testing in Non-Destructive Testing;Sensors;2022-12-28
4. Research on typical failure modes of hybrid integrated quartz flexible accelerometer servo circuit caused by multi-layer ceramic capacitors;Journal of Physics: Conference Series;2021-05-01
5. An Overview of Condition Monitoring Techniques for Capacitors in DC-Link Applications;IEEE Transactions on Power Electronics;2021-04
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