A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances-Reference-Cited by-同舟云学术

A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances

Published:2023-04 Issue:2 Volume:11 Page:1722-1736
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Ma Dingkun¹,Xiao Guochun¹,Zhang Tongyu¹^ORCID,Yang Fengtao¹^ORCID,Zhu Mengyu¹^ORCID,Yuan Tianshu¹,Ma Liangjun¹,Gan Yongmei¹^ORCID,Wang Laili¹^ORCID

Affiliation:

1. State Key Laboratory of Electrical Insulation and Power Equipment, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China

Funder

Fund of the Natural Science Foundation of China

Science and Technology Project from Headquarters of State Grid Company Ltd.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/10091696/09904579.pdf?arnumber=9904579

Reference35 articles.

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3. Stacked DBC cavitied substrate for a 15-kV half-bridge power module;deshpande;Proc IEEE Int Workshop Integr Power Packag (IWIPP),2019

4. Compact Sandwiched Press-Pack SiC Power Module With Low Stray Inductance and Balanced Thermal Stress

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