Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control-Reference-Cited by-同舟云学术

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Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control

Published:2014 Issue:1 Volume:3 Page:76-84
ISSN:2162-2264
Container-title:IEEE Electromagnetic Compatibility Magazine
language:
Short-container-title:IEEE Electromagn. Compat. Mag.

Author:

Fan Jun,Hardock Andreas,Rimolo-Donadio Renato,Muller Sebastian,Kwark Young H.,Schuster Christian

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Instrumentation,Signal Processing,Software

Link

http://xplorestaging.ieee.org/ielx7/5962381/6798779/06798802.pdf?arnumber=6798802

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of impedance compensation for inductive via holes using capacitors;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20

2. Comprehensive Optimization of Differential Via Design for High-Speed Applications;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

3. Bandwidth Limits of Connector Wipe Stub for Reliable 224 Gbps Signaling;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07

4. A Low-Profile Wideband Patch Antenna With Modified Parasitic Mushroom Structures on Nonperiodic AMC;IEEE Antennas and Wireless Propagation Letters;2023-04

5. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023

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