Comprehensive Optimization of Differential Via Design for High-Speed Applications-Reference-Cited by-同舟云学术

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Comprehensive Optimization of Differential Via Design for High-Speed Applications

Published:2023-07-29 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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Author:

Huang Nick K. H.¹,Lai Jim¹

Affiliation:

1. Compute Group,Hewlett Packard Enterprise,Taiwan COE

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10241361/10241364/10241442.pdf?arnumber=10241442

Reference7 articles.

1. Dispelling Via Stub Anxieties;simonovich;White Paper LAMSIM Enterprises com,2017

2. Estimating the Via-Plane Capacitance for Differential Vias with Shared-Antiad Based on Analytical Equations;zhang;IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),2017

3. Optimization of Microstrip-to-Via Transition for High-Speed Differential Signaling on Printed Circuit Boards by Suppresion of the Parasitic Modes in Shared Antipads;duan;IEEE International Symposium on Electromagnetic Compatibility (EMC),2014

4. Differential Via Modeling Methodology

5. Via Design Optimization for Server Applications

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1. Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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