Author:
Wang Chenxi,Suga Tadatomo
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
2. Cu-Cu Hybrid Bonding;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
4. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023
5. High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating;Micromachines;2022-12-07