Advanced warpage prediction methodology for matrix stacked die BGA during assembly processes-Reference-Cited by-同舟云学术

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Advanced warpage prediction methodology for matrix stacked die BGA during assembly processes

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Container-title:2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
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Author:

Xueren Zhang ,Tong Yan Tee

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9210/29234/01319399.pdf?arnumber=1319399

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

2. From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing;Microelectronics Reliability;2017-06

4. Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement;Soldering & Surface Mount Technology;2014-05-27

5. Development of a Cu/Low-$k$ Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-03

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