Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing-Reference-Cited by-同舟云学术

Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing

Published:2017-06 Issue: Volume:73 Page:136-145
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kim Cheolgyu,Lee Tae-Ik,Kim Min Sung,Kim Taek-Soo

Funder

Wearable Platform Materials Technology Center

Basic Science Research Program

National Research Foundation

Ministry of Science, ICT and Future Planning (MSIP)

Graphene Materials and Components Development Program of MOTIE/KEIT

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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