Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints-Reference-Cited by-同舟云学术

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Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints

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Container-title:2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
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Author:

Yokomine K.,Shimizu N.,Miyamoto Y.,Iwata Y.,Love D.,Newman K.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7382/20058/00928014.pdf?arnumber=928014

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bump Height at Low Temperature Analysis;Applied Mechanics and Materials;2013-09

2. Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-11

3. Interfacial Reactions Between Sn-Zn Alloys and Au Substrate;Journal of Electronic Materials;2012-08-07

4. Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-09

5. Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate;Journal of Alloys and Compounds;2011-03

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