Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking-Reference-Cited by-同舟云学术

Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking

Published:2012-11 Issue:11 Volume:2 Page:1777-1785
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Aibin Yu ,Kumar A.,Soon Wee Ho ,Hnin Wai Yin ,Lau J. H.,Su Nandar,Khong Chee Houe ,Jong Ming Ching ,Kripesh V.,Chen S.,Chien-Feng Chan ,Chun-Chieh Chao ,Chi-Hsin Chiu ,Chang-Yueh Chan ,Chin-Huang Chang ,Chih-Ming Huang ,Chen C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6342919/06305526.pdf?arnumber=6305526

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