15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications-Reference-Cited by-同舟云学术

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

Published:2014-01-01 Issue:4S Volume:53 Page:04EB04
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Tung Bui Thanh,Kato Fumiki,Watanabe Naoya,Nemoto Shunsuke,Kikuchi Katsuya,Aoyagi Masahiro

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference37 articles.

1. First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate

2. High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology

3. High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection

4. Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps;Japanese Journal of Applied Physics;2019-12-09

2. Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement;Sensors;2017-04-18

3. A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

4. Copper-Filled Through-Silicon Vias With Parylene-HT Liner;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-04

5. A method enabling height-control of chips for edge-emitting laser stacking;Japanese Journal of Applied Physics;2015-03-27