Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://iopscience.iop.org/article/10.7567/1347-4065/ab5697/pdf
Reference30 articles.
1. Vertical interconnects of microbumps in 3D integration
2. Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging
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