Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration-Reference-Cited by-同舟云学术

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Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration

Published:2013-04 Issue:4 Volume:3 Page:558-565
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Nimura Masatsugu,Mizuno Jun,Shigetou Akitsu,Sakuma Katsuyuki,Ogino Hiroshi,Enomoto Tomoyuki,Shoji Shuichi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6490033/06449300.pdf?arnumber=6449300

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review of Mechanism and Technology of Hybrid Bonding;Journal of Electronic Packaging;2024-07-25

2. Cu-SiO₂ Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Study of Atomic Layer Deposition of Hafnium Oxide as an Insulation Layer on Cu for Potential Flip Chip Integration;2021 IEEE CPMT Symposium Japan (ICSJ);2021-11-10

4. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications;2021 IEEE International 3D Systems Integration Conference (3DIC);2021-10

5. New Era of Device Science;2019 Pan Pacific Microelectronics Symposium (Pan Pacific);2019-02

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