A Broadband 300 GHz Power Amplifier in a 130 nm SiGe BiCMOS Technology for Communication Applications

Author:

Bucher Thomas1ORCID,Grzyb Janusz1ORCID,Hillger Philipp1ORCID,Rucker Holger2ORCID,Heinemann Bernd2ORCID,Pfeiffer Ullrich R.1ORCID

Affiliation:

1. Institute for High-Frequency and Communication Technology (IHCT), University of Wuppertal, Wuppertal, Germany

2. IHP-Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany

Funder

Deutsche Forschungsgemeinschaft (DFG) through the Project DotSeven2IC

Project C04

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Multi-Band Wireless Communication Networks: Fundamentals, Challenges, and Resource Allocation;IEEE Transactions on Communications;2024-07

2. A 15.7-dBm 164–270 GHz Power Amplifier with Asymmetric Slotline-Based Series-Parallel Combiner in 130-nm SiGe BiCMOS Technology;2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2024-06-16

3. Highly-Compact 20-mW, 270–320-GHz InGaAs mHEMT Power Amplifier MMIC;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16

4. A 206–264 GHz Power Amplifier Based on a High-Linearity Cascode Core With 15 dB Gain and 12.2-dBm P sat in 130-nm SiGe BiCMOS;IEEE Transactions on Terahertz Science and Technology;2024-03

5. A 300 GHz x9 Multiplier Chain With 9.6 dBm Output Power in 0.13-μm SiGe Technology;2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF);2024-01-21

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