Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias
Author:
Affiliation:
1. School of Electronic Science and Engineering, Xiamen University, Xiamen, China
2. Xiamen Sky Semicondutor Technology Company Ltd., Xiamen, China
3. Microsystem Technology Company, Ltd., Nanjing, China
Funder
National Natural Science Foundation of China
Science and Technology Major Project of Xiamen City
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/9780621/09760441.pdf?arnumber=9760441
Reference14 articles.
1. Advanced Development in Packaging of Antenna-integrated Systems for Millimeter-wave Applications
2. Transparent mm-Wave Array on a Glass Substrate with Surface Wave Reduction
3. Solid–Liquid Interdiffusion Bonding of Cu–Sn–Cu Interconnection and Sealing for High-Temperature Pressure Sensor Based on Graphene
4. D-Band Wideband Air-Filled Plate Array Antenna With Multistage Impedance Matching Based on MEMS Micromachining Technology
5. A wideband right-angle transition between thin substrate integrated waveguide and rectangular waveguide based on multi-section structure
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