Advanced Development in Packaging of Antenna-integrated Systems for Millimeter-wave Applications
Author:
Affiliation:
1. Georgia Institute of Technology,School of Electrical and Computer Engineering,Atlanta,GA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9714514/9714521/09714588.pdf?arnumber=9714588
Reference24 articles.
1. Intra- and Inter-Chip Transmission of Millimeter-Wave Interconnects in NoC-Based Multi-Chip Systems
2. Antenna in LTCC Technologies: A Review and the Current State of the Art
3. Packaging of MMICs in multilayer LCP substrates
4. RF SoP for Multi-band RF and Millimeter-wave Systems;tentzeris;Adv Packag Mag,2004
5. Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Laser Enhanced Direct-Print Additive Manufacturing (LE-DPAM) of mm-Wave Antenna using LTCC Dielectric Paste for High Temperature Applications;2023 IEEE Wireless and Microwave Technology Conference (WAMICON);2023-04-17
2. Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias;IEEE Electron Device Letters;2022-06
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