Bevel rinse optimization for reduced edge defectivity and improved edge yield
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7486622/7491073/07491136.pdf?arnumber=7491136
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fine Edge and Bevel Film Cut Accuracy by a Novel and High Precision Wafer Centering System;Solid State Phenomena;2023-08-14
2. An Investigation of Edge Bead Removal Width Variability, Effects and Process Control in Photolithographic Manufacturing;IEEE Transactions on Semiconductor Manufacturing;2022-02
3. A Systematic Study on BEOL Defectivity Control for Future AI Application;2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2020-08
4. Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool;Solid State Phenomena;2018-08
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