Fine Edge and Bevel Film Cut Accuracy by a Novel and High Precision Wafer Centering System

Abstract

As more and more wafer dies are produced at the edge of the wafer, wafer edge cleaning and etching has become increasingly important in the manufacturing process of complex thin film laminated integrated circuits. If the edge cut accuracy is not well controlled, the effective removal of film and contaminants will not be achieved. In this paper, we propose a fine edge cut control process with a novel and high precision wafer centering method. A high precision wafer centering system for determining and correcting the position of a wafer on its chuck so as to ensure the uniformity of the width of the wafer edge etched. A fine edge cut profile is beneficial for subsequent film growth, and excellent cleaning capability can prevent buildup of flakes and defects on the bevel. All the above advantages contribute to the improvement of wafer edge yield in the future of chip manufacturing.