Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool-Reference-Cited by-同舟云学术

Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool

Published:2018-08 Issue: Volume:282 Page:220-225
ISSN:1662-9779
Container-title:Solid State Phenomena
language:
Short-container-title:SSP

Author:

Venegoni Ivan¹,Brazzelli Silvia¹,Gomarasca Roberta¹,Pipia Francesco¹,Alessandri Mauro¹

Affiliation:

1. STMicroelectronics

Abstract

The defectivity of a batch process for polymer removal in AlCu BEOL technology has been investigated, reasearching the defectivity source and studying the composition of the defects. Different solutions for the minimization of this defectivity have been found, working on the positioning of the wafers or additional cleanings. The complete eradication of the defectivity has also been demonstrated performing the process on a single wafer tool.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.scientific.net/SSP.282.220.pdf

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