Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7018205/7030792/07030828.pdf?arnumber=7030828
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimum Phase Count in a 5.4-W Multiphase Buck Converter Based on Output Filter Component Energies;IEEE Transactions on Power Electronics;2023-04
2. Novel Power Delivery Network Design and Pre-Silicon Validation Supporting Heterogeneous Dies on a Single Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-01
4. Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V Integrated Voltage Regulators;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. Package Design Optimization for Intel SoC Xeon-D;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-04
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