Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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1. Efficient Error-Resilient Bus Coding Method Using Bit-Basis Orthogonal Integrative Multiplexing;IEEE Transactions on Emerging Topics in Computing;2021
2. Accurate BGA Package Solder Joint Modeling for High Speed SerDes Interfaces;2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2020-10
3. Voltage-in-Current Latency Insertion Method for Diodes and MOSFETs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-10