Novel Power Delivery Network Design and Pre-Silicon Validation Supporting Heterogeneous Dies on a Single Package
Author:
Affiliation:
1. Intel Corporation,DataCenter Power Solutions DCAI,Phoenix,USA
2. Nvidia Corporation,DataCenter System Power DCSE,Hillsboro,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816527.pdf?arnumber=9816527
Reference15 articles.
1. Switching voltage regulator modeling and its applications in power delivery design
2. Novel Methodology for Validating SIMPLIS Based VR Models for Server Platform Power Delivery Prediction
3. Decoupling capacitor derating study under DC bias and cooling environment
4. Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket
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1. Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. On-silicon Capacitor Sharing Technique Based on Package Power Merging for PDN Optimization;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
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