60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects-Reference-Cited by-同舟云学术

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60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects

Published:2007-11 Issue:11 Volume:17 Page:784-786
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Wei-Cheng Wu ,Li-Han Hsu ,Chang E.Y.,Karnfelt C.,Zirath H.,Starski J.P.,Yun-Chi Wu

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx5/7260/4375329/04357997.pdf?arnumber=4357997

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wafer Level 3D-stacked Integration Technology with Coplanar Hot via MMIC for mm-Wave Low-profile Applications;Progress In Electromagnetics Research Letters;2024

2. Research on heat dissipation of RF microsystem 3D packaging based on gold stud bumps and Au-Sn eutectic welding;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Optimised Hot-Via Transition with 20 dB Return Loss for MMIC Packaging from DC to 110 GHz;2021 51st European Microwave Conference (EuMC);2022-04-04

4. Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC;NAECON 2021 - IEEE National Aerospace and Electronics Conference;2021-08-16

5. Connecting Chips With More Than 100 GHz Bandwidth;IEEE Journal of Microwaves;2021-01

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