Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC-Reference-Cited by-同舟云学术

Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC

Published:2021-08-16 Issue: Volume: Page:
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Container-title:NAECON 2021 - IEEE National Aerospace and Electronics Conference
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Author:

Abdullatif Mohammad Salah¹,Noorizadeh Sahand¹,Hajjar Salam²

Affiliation:

1. National Instruments,Microwave Technology Architecture,Santa Rosa,California,USA

2. West Virginia University, Institute of Technology,Beckley,West Virginia,USA

Publisher

IEEE

Link

Reference6 articles.

2. Design data for hot-via interconnects in chip scale packaged MMICs up to 110 GHz;bessemoulin;34th European Microwave Conference,2004

3. 60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects;wu;IEEE Microwave and Wireless Components Letters,2007

4. Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30 µm;thomas oppert;International Symposium on Microelectronics,2011

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

2. Design of a 22-55 GHz SPDT Switch MMIC with GaAs PIN Diodes;2023 18th European Microwave Integrated Circuits Conference (EuMIC);2023-09-18