Package Modeling and Characterization of C-Band 10-Watt High-Power Amplifier Monolithic Microwave Integrated Circuit used in High-Reliability Applications

Author:

Gugulothu Ravi,Bhalke Sangam,Lalkishore K.,Dasari Ramakrishna

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,General Computer Science

Reference16 articles.

1. D.P. Seraphim, R. Lasky, C.-Y. Li, Principles of Electronic Packaging (McGraw-Hill Inc., New York, 1989)

2. P.E. Garrou, I. Turlik, Multichip Module technology Handbook (McGraw-Hil Inc., New York, 1998)

3. A.J. Babiarz, Chip size Packaging, Advanced Packaging, (1995), pp. 30–32

4. K. Jayaraj, Thomas E. Noll, Donald R. Singh, A low-cost multichip packaging technology for monolithic microwave integrated circuits. IEEE Trans. Antennas Propag. 43(9), 992–997 (1995)

5. L.M. Levinson (ed.), Electronic Ceramics: Properties, Devices, and applications (Marcel Dekker Inc, New York, 1988)

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