Principles of Electronic Packaging-Reference-Cited by-同舟云学术

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Principles of Electronic Packaging

Published:1989-06-01 Issue:2 Volume:111 Page:162-163
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Seraphim Donald P.,Lasky Ronald,Li Che-Yu,Engel Peter A.¹

Affiliation:

1. Department of Mechanical and Industrial Engineering, SUNY-Binghamton, Binghamton, NY 13901

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/111/2/162/5541468/162_2.pdf

Cited by 61 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Strength analysis of solder joints used in microelectronics packaging;Eksploatacja i Niezawodnosc - Maintenance and Reliability;2020-03-16

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