Research on heat dissipation of RF microsystem 3D packaging based on gold stud bumps and Au-Sn eutectic welding
Author:
Affiliation:
1. Tianjin University,School of Microelectronics,Tianjin,China
2. The 13th Research Institute of CETC,Shijiazhuang,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873357.pdf?arnumber=9873357
Reference10 articles.
1. Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
2. Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration
3. Three-dimensional finite-element thermal simulation of GaN-based HEMTs
4. 60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects;wu;IEEE Microwave and Wireless Components Letters,2007
5. Interconnect Quality and Reliability of 3D Packaging: 3D Microelectronic Packaging;wang;Semiconductor technology,2021
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