Identification of Multiple Failure Mechanisms for Device Reliability Using Differential Evolution-Reference-Cited by-同舟云学术

Identification of Multiple Failure Mechanisms for Device Reliability Using Differential Evolution

Published:2023-12 Issue:4 Volume:23 Page:599-614
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Chakraborty Uttara¹^ORCID,Bender Emmanuel²^ORCID,Boning Duane S.³^ORCID,Thompson Carl V.⁴^ORCID

Affiliation:

1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA

2. Department of Electrical and Electronic Engineering, Ariel University, Ariel, Israel

3. Department of Electrical Engineering and Computer Science, Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA

4. Department of Materials Science and Engineering, Materials Research Laboratory, Massachusetts Institute of Technology, Cambridge, MA, USA

Funder

CHIMES

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/10346019/10302448.pdf?arnumber=10302448

Reference31 articles.

1. 3D integration for energy efficient system design

2. 2.5D and 3D Heterogeneous Integration: Emerging applications

3. 3D Packaging for Heterogeneous Integration

4. Materials for heterogeneous integration

5. Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

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