3D Packaging for Heterogeneous Integration
Author:
Affiliation:
1. AMD: Advance Packaging,Santa Clara,USA
2. AMD: Advance Packaging,Hsinchu,Taiwan
3. AMD: Advance Packaging,Bangalore,India
4. AMD: Advance Packaging,Austin,TX
5. AMD: Silicon Design Engineering,Fort Collings,CO
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816667.pdf?arnumber=9816667
Reference10 articles.
1. InFO (Wafer Level Integrated Fan-Out) Technology
2. High-Performance Computing: Services and Products Essential to our Daily Lives;su;Computer,2021
3. Three dimensional dynamic access memories;kirihata;presented at the 4th Int IEEE Workshop on Low Temperature Bonding for 3D Integration,2014
4. 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects
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