Thermal Aware Don't Care Filling to Reduce Peak Temperature and Thermal Variance during Testing
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6689800/6690589/06690609.pdf?arnumber=6690609
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal-aware Test Data Compression for System-on-Chip Based on Modified Bitmask Based Methods;Journal of Electronic Testing;2020-10
2. Low Cost Test Pattern Generation in Scan-Based BIST Schemes;Electronics;2019-03-12
3. Genetic Algorithm-based thermal uniformity–aware X-filling to reduce peak temperature during testing;Measurement and Control;2018-07-02
4. Temperature and data size trade-off in dictionary based test data compression;Integration;2017-03
5. Compression-Friendly Low Power Test Application Based on Scan Slices Reusing;JSTS:Journal of Semiconductor Technology and Science;2016-08-30
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