Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
4 articles.
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1. Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill;Journal of Electronic Packaging;2013-12-31
2. Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill;IEEE Transactions on Electronics Packaging Manufacturing;2009-04
3. Void Formation Study of Flip Chip in Package Using No-Flow Underfill;IEEE Transactions on Electronics Packaging Manufacturing;2008-10
4. Technology development and basic theory study of fluid dispensing - a review;Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)