Practical Design of Lensed Fibers for Semiconductor Laser Packaging Using Laser Welding Technique-Reference-Cited by-同舟云学术

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Practical Design of Lensed Fibers for Semiconductor Laser Packaging Using Laser Welding Technique

Published:2009-06 Issue:11 Volume:27 Page:1533-1539
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Jeong Hwan Song ,Fernando H.N.J.,Roycroft B.,Corbett B.,Peters F.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/50/4957554/04840455.pdf?arnumber=4840455

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process;Welding in the World;2022-11-14

2. In-Situ Study of Dynamics of Refractive Index Changes in Silicon Devices Induced by UV-light Irradiation;IEEE Photonics Journal;2022-08

3. In-Situ Study of Dynamics of Refractive Index Changes in Silicon Devices Induced by Uv-Light Irradiation;SSRN Electronic Journal;2022

4. Contactless Optical Packaging Concept for Laser to Fiber Coupling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-06

5. Study of coupling optics involving graded index fiber excitation via upside down tapered parabolic microlens on the fiber tip;Optik;2019-12

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