Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process-Reference-Cited by-同舟云学术

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Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process

Published:2022-11-14 Issue:1 Volume:67 Page:63-76
ISSN:0043-2288
Container-title:Welding in the World
language:en
Short-container-title:Weld World

Author:

Wang Ziyang,Zhou Haibo,Zhou Wangwang,Li Zhiqiang,Ju Xia,Peng Yichang,Duan Ji’an

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://link.springer.com/content/pdf/10.1007/s40194-022-01404-3.pdf

Reference30 articles.

1. Jeong Hwan S, Fernando HNJ, Roycroft B, Corbett B, Peters FH (2009) Practical design of lensed fibers for semiconductor laser packaging using laser welding technique. J Lightwave Technol 27:1533–1539

2. Hsu Y-C, Kuang J-H, Tsai Y-C, Cheng W-H (2008) High yield coaxial-type laser module packages using on-line monitoring system. Opt Commun 281:725–731

3. Lin CT, Chiou BS, Chi S (2006) Study on the weldability of stainless steel fabricated by powder metallurgy and metal injection molding for optoelectronic packages. Opt Eng 45:084002

4. Hsu Y-C, Lin S-H, Tsai H-H, Hong S-P (2014) Experiment and simulation on reduction of postweld shift on butterfly-type laser module by Nd:YAG laser welding and separated dual clips. Fiber Integr Opt 33:315–324

5. Song JH, Roycroft B, Corbett B, Peters FH (2010) Experimental investigation of laser welding assembling sequences for butterfly laser module packages. Opt Eng 49:014301

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