Experimental investigation of laser welding assembling sequences for butterfly laser module packages
Author:
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference14 articles.
1. J.-H. Kuang and T.-P. Hung , “Laser hammering technique in butterfly laser diode module,” inProc. 9th Electronics Packaging Technology Conf., pp. 874–881, IEEE, Piscataway, NJ (2007).
2. A Notch-Saddle-Compensation Technique in Butterfly-Type Laser Module Packages
3. Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: Simulation and experiment
4. A novel inspection of fiber post-weld-shift in butterfly laser module packaging
5. WIAD Minimization in Butterfly Laser Module Packages: Clip Design
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