Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
10 articles.
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1. Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips;Science China Technological Sciences;2022-07-18
2. Introduction to Hybrid System-in-Foil;Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil;2022
3. Motivation;Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil;2022
4. Flexible and Stretchable Microwave Electronics: Past, Present, and Future Perspective;Advanced Materials Technologies;2020-11-09
5. A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-11