Introduction to Hybrid System-in-Foil

Author:

Elsobky Mourad

Publisher

Springer International Publishing

Reference73 articles.

1. Burghartz JN, Alavi G, Albrecht B, Deuble T, Elsobky M, Ferwana S, Harendt C, Mahsereci Y, Richter H, Yu Z (2019) Hybrid systems-in-foil-combining the merits of thin chips and of large-area electronics. IEEE J Electron Devices Soc 7:776–783

2. (2020) NXP semiconductors. Available https://www.nxp.com/products/security-and-authentication/security-controllers/ultra-thin-contactless-chip-module-mob10:MOB10

3. Infineon Technologies AG (2020). Available https://www.infineon.com/cms/de/about-infineon/press/market-news/2018/INFDSS201811-021.html

4. Xu S, Jayaraman A, Rogers J (2019) Skin sensors are the future of health care. Nature 571:319–321

5. IDTechEX (2020) Available http://www.idtechex.com/de/research-report/electronic-skin-patches-2019-2029/674

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