Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11431-021-2021-4.pdf
Reference38 articles.
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3. Jin P, Fu J, Wang F, et al. A flexible, stretchable system for simultaneous acoustic energy transfer and communication. Sci Adv, 2021, 7: 2507
4. Burghartz J N, Appel W, Harendt C, et al. Ultra-thin chip technology and applications, a new paradigm in silicon technology. Solid-State Electron, 2010, 54: 818–829
5. Gupta S, Navaraj W T, Lorenzelli L, et al. Ultra-thin chips for high-performance flexible electronics. npj Flex Electron, 2018, 2: 8
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