Hydrogen-Related Instability of IGZO Field-Effect Transistors
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore
2. Soitec, Bernin, France
3. College of Engineering, University of Notre Dame, Notre Dame, IN, USA
Funder
Advanced Research and Technology Innovation Centre (ARTIC) Program
NSF
SUPREME Center; one of Semiconductor Research Corporation (SRC)/Defense Advanced Research Projects Agency (DARPA) Joint University Microelectronics Program (JUMP) centers
Ministry of Education Tier 2
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
https://ieeexplore.ieee.org/ielam/16/10508280/10466728-aam.pdf
Reference35 articles.
1. Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors
2. Novel Analog in-Memory Compute with > 1 nA Current/Cell and 143.9 TOPS/W Enabled by Monolithic Normally-off Zn-rich CAAC-IGZO FET-on-Si CMOS Technology
3. Tailoring IGZO-TFT architecture for capacitorless DRAM, demonstrating > 103s retention, > 1011 cycles endurance and Lg scalability down to 14 nm;Belmonte
4. Vertical Channel-All-Around (CAA) IGZO FET under 50 nm CD with High Read Current of 32.8 μA/μm (Vth + 1 V), Well-performed Thermal Stability up to 120 ℃ for Low Latency, High-density 2T0C 3D DRAM Application
5. High Field Temperature-Independent Field-Effect Mobility of Amorphous Indium–Gallium–Zinc Oxide Thin-Film Transistors: Understanding the Importance of Equivalent-Oxide-Thickness Downscaling
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