The Role of Oxygen Vacancy and Hydrogen on the PBTI Reliability of ALD IGZO Transistors and Process Optimization
Author:
Affiliation:
1. School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
2. Huawei Technologies Company Ltd., Shenzhen, China
3. School of Information Science and Engineering, Shandong University, Qingdao, China
Funder
National Key Research and Development Program of China
Shanghai Pilot Program for Basic Research-Shanghai Jiao Tong University
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/16/10508280/10472970.pdf?arnumber=10472970
Reference36 articles.
1. Elevated-Metal Metal-Oxide (EMMO) Thin-Film Transistor: Technology and Characteristics
2. Nanometre-thin indium tin oxide for advanced high-performance electronics
3. BEOL Compatible Dual-Gate Ultra Thin-Body W-Doped Indium-Oxide Transistor with Ion = 370μA/μm, SS = 73mV/dec and Ion /Ioff Ratio > 4×109
4. Capacitor-less, Long-Retention (>400s) DRAM Cell Paving the Way towards Low-Power and High-Density Monolithic 3D DRAM
5. Achieving a Low-Voltage, High-Mobility IGZO Transistor through an ALD-Derived Bilayer Channel and a Hafnia-Based Gate Dielectric Stack
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