Electrical, Thermal and Stress Simulation Analyses of SiC MOSFET Power Integrated Module (PIM) Development-Reference-Cited by-同舟云学术

Electrical, Thermal and Stress Simulation Analyses of SiC MOSFET Power Integrated Module (PIM) Development

Published:2021-11-16 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Future Energy Electronics Conference (IFEEC)
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Author:

Wu Sheng-Tsai,Chiu Po-Kai,Cheng Yu-Hua,Lin Hsin-Han,Wu Han-Lin,Yu Tai-Jyun,Ni Tzu-Hsuan,Tseng Chun-Hua,Yeh Meng-Tsung,Wang Cheng-Yi,Tzeng Chih-Ming,Kao Kuo-Shu

Funder

Ministry of Economic Affairs

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9661583/9661588/09661865.pdf?arnumber=9661865

Reference9 articles.

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3. Resin Encapsulation Combined with Insulated Metal Baseplate for Improving Power Module Reliability;asada;PCIM Europe 2016 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,2016

4. The development of high performance in hybrid SiC power integrated module (PIM);chang;International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management PCIM Europe digital days 2020,0

5. Design for reliability of power electronics modules;hua;Microelectronics Reliability,2009

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