Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx4/5459/14724/00670553.pdf?arnumber=670553
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Analytical Solution for Moisture Diffusion with Initial Non-Uniform Moisture Concentration used in Bake Time Study in Electronics Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect;Materials Research Express;2018-08-15
3. Peridynamic wetness approach for moisture concentration analysis in electronic packages;Microelectronics Reliability;2017-03
4. Accelerated preconditioning for stack die packages;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010
5. New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels;Moisture Sensitivity of Plastic Packages of IC Devices;2010
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